Numerical Study on Heat Transfer in a Microchannel with Micro-fins

Wei Long Yeo, Kim Ho Yeap, Koon Chun Lai, Kok Seng Ong, Pei Song Chee

Abstract

We report an extended surface technique that utilises micro-fin arrays to enhance the heat transfer performance in the microchannels at Reynolds number ranging from 400 to 1000. Three different types of microfins namely Case A (cylindrical micro-fin), Case B (offset cylindrical micro-fin) and Case C (diverge cylindrical micro-fin) are designed. A comparative study between the three cases and bare rectangular microchannel was conducted. The technique enhances the thermal dissipation rate while keeping the pressure drop at a satisfactory level through proper design configurations. Numerical study has been performed in order to elucidate the single phase heat transfer phenomena in the present study.

Keywords

Extended surface; Heat transfer enhancement; Microchannel heat sink; Micro-fins; Single phase flow

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References

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